Samsung Electronics and SK hynix are routing the post-processing of standard DRAM to overseas contract manufacturers and Korean back-end partners, freeing limited domestic capacity for high-bandwidth memory (HBM) bound for AI servers. Industry data dated October 6, 2026 shows Korean packaging lines at Cheonan and Onyang tilting toward HBM and advanced packaging, while standardized general-memory work flows to partner facilities in Southeast Asia.

What is driving the back-end realignment?

HBM now accounts for 15% of SK hynix's DRAM shipments in the second quarter of 2026, up from 1% in the first quarter of 2023, according to Counterpoint Research figures cited in industry reporting. Samsung Electronics is gradually raising the volume of post-processing outsourcing for standard memory, including server DDR5 products. The shift concentrates higher-value work at home and standard processes abroad.

Industry experts describe the outsourcing as both a cost lever and a capacity-reclamation tool. As the AI server market expands, HBM demand has risen sharply, forcing prioritization of limited domestic capacity on high-margin parts. The economics favor Korean lines on HBM and advanced packaging while keeping general memory competitive through lower-cost overseas sites.

Which partners handle the work?

Three named suppliers anchor Samsung's overseas back-end network:

• HanYang Digitech (Vietnam)
• Dreamtech (India)
• SFA Semicon (Philippines)

These firms are expanding local factories and ordering additional equipment to absorb larger volumes. An industry source stated: "Samsung Electronics is gradually assigning post-processing orders for general-purpose memory to partner companies. These partners are expanding factory capacity locally and placing additional equipment orders to handle the increased volumes."

How fast is the partner business growing?

SFA Semicon's first-half sales reached 233.6 billion won, up 54.3% year on year, according to Hana Securities. Utilization at its Philippine plant climbed from 39% last year to 65% in the first half of 2026; its Korean plant moved from 33% to 40% over the same period. Samsung Electronics is estimated to account for up to 75% of SFA Semicon's sales.

SK hynix runs a parallel strategy. The Hana Micron subsidiary in Vietnam handles back-end processing of general memory. Its sales climbed from 53.9 billion won in the first half of 2023 to 252.3 billion won in the first half of 2026, a roughly 4.7-fold rise. The pattern mirrors Samsung's outsourcing ramp: domestic lines tighten around HBM while partner sites absorb standardized back-end work.

What changes for testing capacity?

Hana Securities analysts said the outsourcing of final testing for general-purpose memory is also increasing as Samsung Electronics operates its Onyang line with a focus on HBM. Professor Jonghwan Lee of the Department of System Semiconductor Engineering at Sangmyung University stated: "Domestic production volume will be prioritized for HBM, considering supply commitments to customers and higher added value, while any shortfall in general DRAM volume may be supplemented using overseas production bases."

What caveats apply to the data?

Partner-revenue gains reflect both the Samsung-driven outsourcing shift and the broader memory cycle. Higher utilization at overseas sites may also reflect stronger demand from non-Samsung clients, with end-market pricing still in flux. Overseas production bases are expected to take on broader roles, particularly in testing processes.