Hanmi Semiconductor plans to launch its Wide TC Bonder in 2027 and expand its 2.5D packaging equipment lineup for AI chips, according to a Digitimes report. The 2027 date anchors a roadmap that places the company's thermocompression bonding tools directly in the supply chain for high-end AI accelerators.

What is Hanmi building?

The Wide TC Bonder is a thermocompression bonding machine used to attach chips onto interposers and substrates in 2.5D advanced packaging — the architecture behind multi-die AI processors. A wider bonding area allows the tool to handle larger packages, which chipmakers need as AI accelerators grow in die count and package size.

Hanmi already supplies TC bonders to major packaging players. The Wide TC Bonder extends that line toward the larger formats now standard in AI silicon. The 2027 launch window positions the tool for the next generation of 2.5D modules.

Why does 2.5D matter for AI chips?

AI accelerators rely on 2.5D packaging to stack logic dies and high-bandwidth memory around a silicon interposer. Demand for this packaging method has grown with AI chip shipments, and equipment suppliers capable of high-yield bonding at wide formats remain limited.

Hanmi's lineup expansion targets that constraint. By adding a wide-format TC bonder alongside its existing tools, the company covers more steps in the 2.5D production flow for AI customers.

What does the 2027 date signal?

A 2027 launch aligns with the industry's packaging roadmap: chipmakers have committed to larger 2.5D packages through the second half of the decade, and equipment must qualify one to two years before volume production. Hanmi's timing places the Wide TC Bonder inside that qualification window.

The expansion also deepens Hanmi's exposure to AI-driven capital spending, where advanced packaging equipment has become a procurement priority for chip assemblers.

Market impact

• Hanmi adds the Wide TC Bonder to a TC bonder portfolio aimed at 2.5D AI chip packaging.
• The 2027 launch targets larger package formats required by multi-die AI accelerators.
• The lineup expansion widens Hanmi's addressable share of the advanced packaging tool market.

Hanmi has now tied its product roadmap to AI packaging demand through at least 2027.