By Grace Kim

Hanmi Semiconductor presented equipment for HBM4 (high-bandwidth memory, fourth generation) and 2.5D advanced packaging at Semicon West, positioning itself to capture foundry demand beyond its core DRAM customer base.

The Korean equipment maker used the US trade show to display its tool lineup for the two technologies now driving the memory-to-foundry crossover in chip assembly.

What does this change for Hanmi?

It signals a deliberate push beyond HBM bonded assembly tools sold to memory makers. By courting foundries — chip manufacturers that produce designs for other companies — Hanmi widens its addressable market at a moment when 2.5D packaging (stacking dies side by side on an interposer) has moved into mainstream production planning.

HBM4 is the next memory generation demanded by AI accelerator builders. Equipment qualified for it now has a shot at long qualification cycles and early tool placements.

The company did not detail specific foundry customers, order values, or shipment timelines in its Semicon West presentation, according to Chosunbiz.

The foundry push follows the broader industry pattern: packaging capacity, once an afterthought in capex plans, now ranks alongside wafer fabrication in strategic budgets. Toolmakers with qualified 2.5D and HBM4 processes gain leverage in that shift.

Hanmi's showing keeps it on the shortlist as foundries and memory houses tool up for the HBM4 ramp. Watch for qualification announcements in coming quarters.