Samsung Electronics has proposed a mid-$4 price per gigabit for 2027 high-bandwidth memory (HBM4) supply, more than three times the roughly $1.50 price of current HBM3E, according to a report by Token Post. The figure emerges as chipmakers negotiate supply contracts for artificial intelligence systems.

The final negotiated price will directly affect Samsung's 2027 HBM average selling price and profitability, since the company's product mix shifts toward HBM4 in that period. A substantial portion of next year's HBM capacity has already been negotiated. Micron has gone further, signing agreements covering most of its 2027 HBM bit supply.

Micron Chief Executive Sanjay Mehrotra said HBM prices next year would be "far higher than 2026." Samsung's final contract prices remain a key variable in the market. SK Hynix is still negotiating its 2027 supply volumes and prices with customers.

2027 price estimates point to a 121% increase

Industry estimates put the average HBM selling price in 2027 about 121% above this year's level. A 12-layer, 36GB HBM4 unit is estimated to rise from about $600 this year to about $1,300 next year.

These figures are estimates rather than disclosed contract prices. Actual prices vary by customer, specifications and contract terms, which limits the precision of any single market-wide number.

Supply constraints underpin pricing

HBM vertically stacks DRAM dies and consumes more wafer capacity than conventional DRAM. That structural property makes supply difficult to expand quickly, even at sharply higher prices.

Samsung's final HBM4 contract prices remain a factor to watch for the memory market. Qualification timelines and production yields at the company are the other two variables that will determine how much of the proposed pricing converts into realized revenue.

The pricing developments follow earlier reporting on Micron's HBM demand and the broader memory cycle, which pointed to tightening supply conditions across the DRAM segment.