Test report DSG-7288 · Rev A · tested October 10, 2026

Edge AI SiliconDevice under test

SEMIFIVE Signs Turnkey Deal with Mobilint for Robotics AI Chip

SEMIFIVE will develop a robotics AI chip for Mobilint under Korea's K-On-Device AI Semiconductor program, carrying the project from architecture through packaged silicon on a turnkey basis.

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Amara Osei

Spec summary

  1. SEMIFIVE signed a turnkey contract with Mobilint to develop a robotics AI chip
  2. The project runs under South Korea's 'K-On-Device AI Semiconductor' government program
  3. SEMIFIVE is responsible for the full development cycle from architecture to production-ready silicon
  4. Financial terms, process node and delivery timeline were not disclosed
SEMIFIVE Signs Turnkey Contract with Mobilint to Develop Robotics AI Chip Under 'K-On-Device AI Semiconductor' Program -
Fig. ASEMIFIVE Signs Turnkey Contract with Mobilint to Develop Robotics AI Chip Under 'K-On-Device AI Semiconductor' Program - — AI-generated

SEMIFIVE has signed a turnkey contract with Mobilint to develop an AI semiconductor aimed at robotics applications, the two companies announced via PR Newswire. The work proceeds under South Korea's "K-On-Device AI Semiconductor" program, the government-backed initiative that funds domestic development of edge inference processors.

The deal pairs two Korean players at different points of the chip supply chain. SEMIFIVE supplies turnkey silicon development — design platform, chiplet-based architecture, and back-end coordination through to packaged silicon. Mobilint builds AI accelerators and the software stack that runs on them. Under the agreement, Mobilint's robotics-focused requirements will be realized as a working device through SEMIFIVE's design and manufacturing flow.

What does the contract cover?

A turnkey engagement of this type places responsibility for the full development cycle on the foundry-side partner. For Mobilint, that means SEMIFIVE will carry the chip from specification to production-ready silicon rather than delivering design services alone.

The scope typically includes:

  • Architecture planning and RTL integration on a proven design platform
  • Physical design, verification and sign-off
  • Foundry fabrication management and packaging
  • Delivery of tested silicon ready for Mobilint's software integration

The target device is an on-device AI chip for robotics. That application class demands high inference throughput at constrained power budgets, since robots must run perception, localization and control models locally rather than in the cloud.

Why does the 'K-On-Device AI Semiconductor' program matter?

The Korean government launched the K-On-Device AI Semiconductor program to reduce dependence on foreign processor suppliers and build a domestic ecosystem for edge AI silicon. Selected projects receive state support in exchange for demonstrable progress toward commercializable on-device AI chips.

Robotics is one of the priority verticals. Edge inference in robots imposes requirements that differ from data-center accelerators: thermal limits, real-time latency guarantees, and tolerance for vibration and power fluctuation. A domestic supply of processors built for those conditions serves both industrial automation and the country's broader robotics sector.

For SEMIFIVE, the contract extends a business model the company has built around design platforms and chiplet reuse, applied here to a government-supported AI program. For Mobilint, it provides a route to custom silicon without maintaining a full in-house chip development organization.

What happens next?

Development work under the contract begins with definition of the robotics chip's architecture and performance targets, followed by implementation on SEMIFIVE's platform. Neither company disclosed financial terms, target process node, or a delivery timeline in the announcement.

The agreement signals continued momentum in Korea's state-backed push into on-device AI silicon, with robotics emerging as a concrete first destination for the technology. Further details on specifications and milestones are expected as the program progresses.

Die Signal will track the project as engineering details become public.

via Google News: AI chip (Source)

Filed under

  • semifive
  • mobilint
  • robotics-ai
  • k-on-device-ai-semiconductor
  • chiplet-design
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Amara Osei

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Staff writer covering business strategy at Die Signal.

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