Test report DSG-2706 · Rev E · tested October 20, 2026
Memory & StorageDevice under test
Samsung Commits 70% of Memory Capacity Through 2031
Samsung has locked 70% of its memory capacity into contracts running to 2031, with long-term HBM deals priced five times below spot as AI demand chokes DRAM supply.
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- Grace Kim
Spec summary
- Samsung has committed roughly 70% of its memory capacity to long-term deals running through 2031.
- Long-term HBM contract prices run about five times below spot prices.
- AI data-center demand is choking conventional DRAM supply for spot buyers.

Samsung has locked roughly 70% of its memory manufacturing capacity into long-term supply agreements running through 2031, according to a Wccftech report — a commitment that removes most of its output from the open market until the end of the decade.
The scale matters. When a supplier controlling one of the world's largest DRAM and NAND (flash memory) footprints ties up 70% of capacity in multi-year contracts, spot buyers — anyone purchasing on the short-term market — lose access to the bulk of available supply. What's left competes for a shrinking pool.
How cheap are the long-term deals?
The report puts long-term HBM (high bandwidth memory, the stacked-DRAM modules used in AI accelerators) contract pricing at roughly five times below spot prices. That gap tells you where the leverage sits. Customers who signed early, chiefly AI data-center operators, secured supply at a fraction of what panic buyers now pay on the spot market.
Five-to-one is not a normal discount. It signals that spot pricing has detached from production costs, driven by scarcity rather than fundamentals.
What does this change for buyers?
For anyone outside the 2031 deals, the practical answer is: very little supply, at very high prices. Contract-less DRAM purchasers — smaller server builders, consumer electronics firms, channel assemblers — face a market where Samsung's output is largely spoken for. They compete for residual capacity from other vendors and whatever spot volume leaks through.
AI demand is the engine behind the squeeze. HBM and conventional DRAM consumption by data-center operators has grown fast enough that memory makers prioritize their largest, longest-committing customers. Everyone else gets the remainder — or nothing.
Why 2031?
Commitments stretching to 2031 reflect how AI infrastructure builders plan: they're sizing multi-year GPU and accelerator deployments now and need memory supply guaranteed for the life of those systems. Suppliers like Samsung, in turn, get demand visibility that justifies capacity expansion without spot-market risk.
The deal structure locks in both sides. Buyers get pricing roughly five times below spot. Samsung gets revenue certainty through 2031 on 70% of its capacity.
Market impact
For the DRAM market overall, the report's framing is blunt: AI demand is choking it. Conventional DRAM buyers now compete with AI procurement for the same fabs, and the biggest supplier has effectively exited the open market for years. Expect continued upward pressure on spot pricing, tighter allocation from remaining vendors, and a widening gap between contract holders and everyone else.
The five-times differential and the 2031 horizon together mark a structural shift. Memory pricing used to swing with consumer electronics cycles. Now it's anchored to AI capital expenditure — and Samsung's 70% commitment shows how much of the industry's output that shift has already absorbed.
via Google News: HBM memory (Source)
More from Grace Kim
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Market editor covering regulation, policy and their impact on hardware layer of artificial intelligence at Die Signal.
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