Hanmi Semiconductor disclosed on October 6, 2026 that it has booked a 24.48 billion Korean won order for Micro Saw & Vision Placement (MSVP) equipment from Samsung Electro-Mechanics. The contract marks the equipment maker's first large-scale Samsung Group order since a 2011 patent litigation win shut off business with a former Samsung Electronics subsidiary.

The MSVP is a back-end process tool that pairs a precision dicing saw with a vision-guided placement module handling cleaning, drying, inspection, sorting and loading of semiconductor packages. Hanmi deploys it across DRAM, NAND flash, high-bandwidth memory (HBM) and system semiconductor lines.

What does the contract signal?

The Samsung Electro-Mechanics order represents the most concrete commercial opening with a Samsung Group entity since Hanmi's 2011 patent victory over Secron, then Samsung Electronics' equipment arm and now operating as Semes. That legal result narrowed the supplier's footprint inside the conglomerate for more than a decade.

In October 2025, Hanmi Semiconductor Chairman Kwak Dong-shin met Samsung Electronics President and CTO Song Jae-hyuk at the Semiconductor Exhibition. Kwak said afterward that he maintains good relations with Samsung and meets frequently. Asked about the prospect of supplying Hanmi's flagship thermocompression (TC) bonder for HBM to Samsung Electronics, Kwak stated: "If the client wishes, we can proceed."

The tone of the latest disclosure is more emphatic. Kwak framed the Samsung Electro-Mechanics deal in a press release announcing the contract with a one-line greeting. "Welcome to the Samsung Group," Kwak said.

What does the MSVP do in the line?

The MSVP combines two functions in one platform. The Micro Saw module cuts finished semiconductor packages with the precision needed for thin, stacked dies used in HBM. The Vision Placement module then cleans, dries, inspects, sorts and loads the cut pieces into downstream carriers. Hanmi had sourced Micro Saw equipment from Japan's Disco before localizing the platform in 2021.

The tool supports multiple product families. Process engineers run it for DRAM and NAND packaging, for HBM stack assembly, and for system semiconductor back-end operations. That breadth makes the platform relevant across memory and logic packaging lines.

Where does Hanmi stand in HBM?

Hanmi's TC bonder for HBM remains the company's flagship product. SK Hynix and Micron anchor the customer roster. Samsung Electronics, the third major HBM producer, has not yet sourced Hanmi TC bonders at scale.

The MSVP is a different product category, but the Samsung Electro-Mechanics order opens a packaging-related line of business inside the Samsung Group. Equipment suppliers frequently leverage an initial tool sale into broader platform wins at the same customer.

What is the order's commercial weight?

At 24.48 billion Korean won, the contract represents one of Hanmi's larger equipment disclosures in recent quarters. Samsung Electro-Mechanics applies the tool in component packaging lines that supply both Samsung Electronics and external customers. The order size indicates multiple system deliveries rather than a single engineering unit.

Hanmi's disclosure did not name a delivery schedule or tool quantity. Semiconductor back-end equipment orders of this size typically ship over multiple quarters and require customer site qualification.

Why is the Samsung relationship reopening now?

Several data points suggest a thaw. The 2025 trade show meeting between Kwak and Song preceded the Samsung Electro-Mechanics contract by roughly a year. The MSVP platform, newly localized to a Korean supply chain since 2021, satisfies a domestic sourcing preference that Korean memory and component makers have stated repeatedly.

The patent dispute with the old Secron, now Semes, no longer appears to block commercial engagement across the group. Hanmi's 2011 win established intellectual property it has continued to defend, but the company has signaled willingness to reopen commercial ties when Samsung affiliates reach out directly.