Test report DSG-3084 · Rev C · tested November 10, 2026

Foundries & ManufacturingDevice under test

YMTC Weighs Fourth Wuhan Fab for 300+ Layer NAND from 2027

Reuters sources say YMTC is weighing a fourth Wuhan fab for 300+ layer NAND with 60–70% Chinese equipment and construction from 2027. YMTC confirms nothing; no orders exist as of November 6.

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Spec summary

  1. Reuters reported on November 6, 2026 that YMTC is considering a fourth Wuhan fab for NAND with more than 300 stacked layers, construction expected in 2027.
  2. Sources said the fab would source at least 60% of equipment from Chinese suppliers, with a 70% ambition; no formal orders exist.
  3. YMTC's third, fourth and fifth fabs are reportedly designed for about 100,000 wafers per month each.
  4. SK hynix posted Q3 2026 revenue of about ₩104.6 trillion and expects the memory shortage to last through 2030.
  5. YMTC reportedly put its Shanghai IPO on hold on November 4, possibly targeting the first half of 2027.
YMTC Eyes 4th Wuhan NAND Fab: 300+ Layers [2026]
Fig. AYMTC Eyes 4th Wuhan NAND Fab: 300+ Layers [2026] — ranjatm / pixabay

YMTC is considering a fourth factory in Wuhan for NAND flash with more than 300 stacked layers, targeting at least 60% of its equipment from Chinese suppliers, Reuters reported on November 6, 2026. Construction would start in 2027. YMTC has confirmed none of these details, and no formal equipment orders exist.

The report landed amid hard numbers from rivals. SK hynix posted third-quarter revenue of about ₩104.6 trillion on October 28, its first quarter above ₩100 trillion, with operating profit of roughly ₩83.3 trillion — a margin near 80%. SanDisk reported fiscal first-quarter 2027 revenue of $11.0 billion on October 29, up 23% sequentially.

What Did Reuters Actually Report?

Sources told Reuters that Yangtze Memory Technologies Co., headquartered in Wuhan, is weighing a fourth fab in the city for NAND aimed at data-center and AI storage. Three planning details accompanied the claim:

  • Chinese suppliers would provide at least 60% of equipment, with an ambition of 70%.
  • Construction would begin in 2027.
  • Supplier talks remain preliminary; no formal orders had been placed as of November 6.

Igor's Lab, summarizing the report the same week, described a wider build-out: YMTC's third, fourth and fifth factories could each process roughly 100,000 wafers per month at full capacity. Business Insider pitched the story at investors, asking whether Micron, SanDisk and SK hynix shareholders should worry. Counterpoint Research was reported ranking YMTC third in global NAND shipments in Q2 2026 with a 14% share.

YMTC has not confirmed the layer count, equipment targets, capacity figures or schedule. Every figure remains source-based reporting.

Why Does the 300-Layer Target Matter?

More layers mean more bits per die and lower cost per terabyte once yields settle. SK hynix reported expanding sales of 321-layer TLC enterprise SSDs on October 28, so a 300-plus-layer YMTC part would land where SK hynix already sells. Reports say Samsung is converting its Xi'an facility toward 286-layer NAND. Layer counts do not compare cleanly across vendors — stacking methods, die sizes and yields differ — but the plan signals YMTC's intent to compete in the densest enterprise tier.

YMTC's product line already points there: its website lists the PE501, a PCIe 5.0 NVMe enterprise SSD, alongside older PCIe 4.0 parts, and its Xtacking 4.0 architecture was recognized as Most Innovative Technology at FMS 2025.

The 60%–70% equipment goal may matter most. A floor of 60% with a 70% ambition suggests YMTC knows some process steps lack a domestic option. The reporting names no supplier, tool type or contract. If orders arrive in 2027, the named domestic suppliers become the real news.

What About Capacity and Funding?

Three fabs at roughly 100,000 wafers per month would give about 300,000 wafers monthly combined, and Reuters reported the expansion could more than double YMTC's capacity. But design capacity is not output: fabs take years to ramp, and yield on a new 300-layer process can lag for quarters.

Funding adds uncertainty. The Economic Times reported on November 4 that YMTC put its Shanghai IPO on hold, potentially delaying the offering by several months, with a possible attempt in the first half of 2027. The IPO process of parent Changjiang Memory Holdings was reportedly suspended. The material does not say whether the pause affects the fab plan.

Where Do Prices Stand Now?

TrendForce projects fourth-quarter 2026 NAND contract prices up 15% to 20%, with conventional DRAM up 10% to 15%, as suppliers shift capacity toward AI servers. Spot markets cooled in early November: DDR4 1Gx8 spot pricing dipped 0.09% to $46.82, and 512Gb TLC NAND wafers fell 4.33% in a week. DDR5 16Gb held flat at $61.50 on November 2.

SK hynix expects the memory shortage to persist through 2030, with long-term agreements covering more than 50% of its 2027 and 2028 capacity. HBM4 shipments have begun. Team Group CEO Chen Ching-wen reportedly warned the shortage could worsen from late 2026 through 2027, with supply and demand not balancing until the second half of 2028 or later. A 2027 YMTC groundbreaking would arrive after the worst of the squeeze, not during it.

SanDisk, meanwhile, announced an eight-for-one stock split effective November 19, 2026, guided second-quarter revenue to $12.2–12.6 billion, and was named exclusive storage partner for Meta VR glasses launching in spring 2027. Micron ships G9 QLC NAND with a 2Tb die and has the PCIe Gen6 9650 SSD in mass production.

The hard fact stands: a fab under consideration, with no orders and a 2027 groundbreaking, cannot move a fourth-quarter 2026 contract price.

via shattered.io (Source)

Filed under

  • ymtc
  • nand-flash
  • wuhan-fabs
  • 300-plus-layer-nand
  • ai-data-center-storage
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Amara Osei

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Staff writer covering money, funding and market shifts around hardware layer of artificial intelligence at Die Signal.

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