Test report DSG-6720 · Rev C · tested October 18, 2026
Memory & StorageDevice under test
Samsung Will Build Nvidia's Next-Gen Memory Chips on TSMC Tech
Samsung will use TSMC technology for Nvidia's next-generation memory chips, a Seoul newspaper reports, reshaping the AI memory supply chain across three hardware giants.
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Spec summary
- Samsung plans to use TSMC technology for Nvidia's next-generation memory chips, a Seoul newspaper reports.
- The report was relayed by CNA; no volumes, dates, or product specifics were disclosed.
- The arrangement would split memory production: Samsung supplies memory layers, TSMC fabricates the logic base die.
- Neither Samsung, TSMC, nor Nvidia has publicly confirmed the deal.

Samsung plans to use TSMC technology to produce next-generation memory chips for Nvidia, according to a report from a Seoul newspaper picked up by CNA. The arrangement, if it holds, links the three biggest names in AI hardware in a single supply chain decision.
That's the headline fact, and the source report is thin on specifics — no volumes, no dollar figures, no named product SKUs. But the shape of the deal matters for anyone building AI systems or tracking memory pricing, because it changes who does what in the HBM chain.
What does the arrangement actually change?
Memory makers don't sell bare dies to Nvidia. High-bandwidth memory reaches the GPU maker as a packaged stack, and the logic layer at the base of that stack has to be fabricated somewhere. The report indicates Samsung will turn to TSMC for that part of the process rather than keeping it in-house.
For practitioners, that's the shift to watch. It means Samsung's memory business would lean on TSMC's logic process for the interface die, while Samsung supplies the memory layers and the stacking know-how. Nvidia, in turn, gets a qualified supply path that doesn't depend on a single foundry relationship.
Why would Samsung share the stack with a rival's foundry?
Qualification is the short answer. Nvidia qualifies suppliers slowly and demands tight process control on the base die, since that's where the memory talks to the GPU. If TSMC's process is already in Nvidia's good books for that layer, Samsung using it lowers the barrier to winning Nvidia orders — which is where the volume is.
The report doesn't say which memory generation is involved, beyond calling it next-generation. It also doesn't specify timing, capacity, or financial terms. Those details will determine whether this is a niche arrangement or a structural realignment of memory sourcing.
Who's affected downstream?
Three groups should care:
- AI system builders: a second qualified memory path for Nvidia platforms could ease the supply squeezes that have marked the HBM market.
- Procurement teams: any broadening of qualified supply tends to matter at renewal time, even if prices don't move immediately.
- Competitors: other memory vendors now face a Samsung that's apparently willing to split the stack to win Nvidia business.
What's still unconfirmed?
Plenty. This rests on a single Seoul newspaper report relayed by CNA, with no on-the-record comment from Samsung, TSMC, or Nvidia in the material available. Treat the specifics — process node, product family, ramp dates — as open questions until any of the three companies confirms.
What's solid enough to plan around is the direction: memory suppliers are increasingly willing to restructure how they build HBM-class products to stay in Nvidia's supply chain. If this report is confirmed, expect the qualification announcements to follow, and expect rival memory makers to answer with their own packaging moves.
We'll update as the companies respond or as documentation emerges.
via Google News: TSMC (Source)
More from Elena Vasquez
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Senior reporter covering people, launches and day-to-day practice in hardware layer of artificial intelligence at Die Signal.
440 articles
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