Test report DSG-8460 · Rev C · tested October 19, 2026

Memory & StorageDevice under test

Samsung Electro-Mechanics Signs 360.5 Billion Won Memory Substrate Deal

Samsung Electro-Mechanics has signed a 360.5 billion won deal to supply substrates for memory products, Chosun Ilbo reported, one of its largest orders in the segment.

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Amara Osei

Spec summary

  1. Samsung Electro-Mechanics signed a 360.5 billion won memory substrate contract.
  2. The deal was reported by Chosun Ilbo on December 2.
  3. The order value equals roughly 250 million US dollars.
  4. The contract covers substrates for memory products.
Samsung Electro-Mechanics Inks 360.5B Won Memory Substrate Deal - 조선일보
Fig. ASamsung Electro-Mechanics Inks 360.5B Won Memory Substrate Deal - 조선일보 — cocoparisienne / pixabay

Samsung Electro-Mechanics has signed a contract worth 360.5 billion won to supply substrates for memory products, according to a report by Chosun Ilbo.

The deal, disclosed on December 2, marks one of the largest single substrate orders the Korean electronics component maker has booked in this segment. Samsung Electro-Mechanics supplies printed circuit boards and chip substrates to semiconductor manufacturers, and memory substrates form a core part of that portfolio.

What does the 360.5 billion won figure represent?

The 360.5 billion won contract value converts to roughly 250 million US dollars at current exchange rates. For Samsung Electro-Mechanics, a supplier that competes with Japan's Ibiden and Shinko Electric as well as Taiwan's Unimicron in the advanced substrate market, an order of this size consolidates its position in memory packaging components.

Substrates carry the electrical connections between a memory chip and the circuit board of the final device. Demand for them tracks the memory market directly: as DRAM and NAND producers raise output, substrate orders follow.

The order arrives as memory makers expand capacity and push higher-specification packaging for AI and server products, segments that require more substrate layers and finer circuit patterns than conventional PC and mobile memory.

Why does this order matter now?

Samsung Electro-Mechanics has spent several years reweighting its business toward chip substrates and away from lower-margin consumer components. A 360.5 billion won memory substrate deal gives that strategy a measurable anchor.

The company operates substrate production lines in Korea and at overseas plants in China and Vietnam, and it has invested in capacity for flip-chip ball grid array substrates, the type used in high-performance memory and processor packages.

For customers, the contract secures supply at a moment when substrate capacity for advanced memory packaging remains tight. For competitors, it signals that Samsung Electro-Mechanics intends to defend share in a market where Japanese and Taiwanese suppliers have historically led.

One contract does not decide a market, but 360.5 billion won buys a serious stake in the memory supply chain.

via Google News: HBM memory (Source)

Filed under

  • samsung-electro-mechanics
  • memory-substrates
  • semiconductor-packaging
  • fc-bga
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Amara Osei

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Staff writer covering money, funding and market shifts around hardware layer of artificial intelligence at Die Signal.

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