Industry analysts project that the blended average selling price (ASP) of high-bandwidth memory (HBM) will jump 121% in 2027, according to a forecast reported by Korea's Maeil Business Newspaper.

The figure refers to the blended ASP across the HBM product stack — a weighted average that combines pricing for all HBM generations shipping in a given year, from legacy HBM2e volumes still in production through the latest HBM3E and successor stacks. A 121% increase means suppliers would realize more than double the average revenue per unit in 2027 compared with the baseline period used in the projection.

Blended ASP is the metric memory producers watch most closely in the HBM segment. Unlike standard DRAM, where price quotes are broadly comparable across vendors, HBM pricing varies sharply by generation, stack height, and qualification status at individual customers. A rise in the blended average therefore signals a mix shift: newer, more expensive stacks are taking a larger share of total shipments, while older HBM products decline as a proportion of output.

The projected increase for 2027 follows the pricing trajectory the HBM market has traced since AI accelerator demand began absorbing the bulk of advanced memory capacity. HBM carries a substantial price premium over conventional DDR5 DRAM on a per-gigabit basis, a premium suppliers justify by the packaging complexity involved: through-silicon vias (TSVs), stacked dies, and co-packaged integration with the logic die that each add cost and manufacturing time relative to planar DRAM.

For the three Korean suppliers — Samsung Electronics, SK hynix, and, at the module level, related packaging partners — the forecast implies a continued widening of the revenue gap between HBM-capable fabs and lines dedicated to commodity DRAM. SK hynix currently leads in HBM share, while Samsung continues to work through customer qualification cycles for its latest generation.

The 121% projection also carries implications for buyers. Hyperscalers and accelerator designers negotiating multi-year supply agreements will face higher average procurement costs per unit of memory bandwidth if the mix shift materializes as forecast. At the same time, suppliers have committed significant capital to HBM capacity expansion, and the balance between that new supply and accelerator demand growth will determine whether the pricing curve holds through 2027 or softens as additional capacity ramps.

Yield dynamics compound the pricing question. HBM yields run below those of standard DRAM because die stacking multiplies defect exposure — a single failed layer can scrap an entire stack. Higher-yielding suppliers capture disproportionate margin at any given ASP, which is why qualification wins at major accelerator customers carry weight beyond the unit volumes they represent.

The Maeil Business Newspaper report did not specify the analyst house behind the 121% figure or the exact baseline year against which the 2027 comparison is measured. Readers evaluating the projection should treat it as directional: it points to a market in which the average HBM unit more than doubles in price as product mix migrates toward the newest generations, but the underlying assumptions about volume distribution and pricing by tier were not disclosed in the report.

What the number does confirm is the direction of travel. Every forecast cycle since the AI buildout began has revised HBM pricing and share expectations upward, and the 2027 blended ASP projection continues that pattern. Memory industry observers will watch the next round of supplier guidance and customer supply agreements for confirmation of the trajectory.